Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014— 16 стр.
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011— 30 стр.
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013— 15 стр.
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010— 22 стр.
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010— 17 стр.
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016— 23 стр.
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016— 29 стр.
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011— 26 стр.
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014— 11 стр.
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011— 13 стр.
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011— 20 стр.
Connectors for electronic equipment - Tests and measurements - Part 25-9: Signal integrity tests - Test 25i: Alien crosstalk (IEC 60512-25-9:2008); German version EN 60512-25-9:2008— 20 стр.
Connectors for electronic equipment - Tests and measurements - Part 16-13: Mechanical tests on contacts and terminations - Test 16m: Un-wrapping, solderless wrapped connections (IEC 60512-16-13:2008); German version EN 60512-16-13:2008— 7 стр.
Connectors for electronic equipment - Tests and measurements - Part 11-12: Climatic tests; Test 11m: Damp heat, cyclic (IEC 60512-11-12:2002); German version EN 60512-11-12:2002— 7 стр.
Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping (IEC 60512-16-7:2008); German version EN 60512-16-7:2008— 9 стр.
Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006— 6 стр.
Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011); German version EN 60352-8:2011— 23 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm Ч 0,63 mm (IEC 60603-8:1990); German version EN 60603-8:1998— 42 стр.
