Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003— 20 стр.
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019); German version EN IEC 60286-3:2019— 45 стр.
Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets (IEC 62610-5:2016); German version EN 62610-5:2016— 19 стр.
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013— 20 стр.
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 2: Details of air flow, air separation and air cooling requirements (IEC 62966-2:2020); German version EN IEC 62966-2:2020— 28 стр.
Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling (IEC 62610-2:2018); German version EN IEC 62610-2:2018— 21 стр.
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 62966-1:2019); German version EN IEC 62966-1:2019— 20 стр.
Mechanical structures for electronic equipment; mechanical structures of the 482,6 mm (19")series; components on front panels; mounting conditions, dimensions— 4 стр.
