Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly— 41 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly— 46 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 71 стр.
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad— 49 стр.
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly— 46 стр.
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly— 28 стр.
Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)— 6 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile— 16 стр.
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 0 стр.
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 36 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Communication cables. Specifications for test methods. Test methods for UV resistance evaluation of the sheath of electrical and optical fibre cable— 22 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies— 32 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling— 18 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Surface mount fixed tantalum electrolytic capacitors with solid (MnO$d2) electrolyte— 34 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed aluminium electrolytic surface mount capacitors with solid (MnO$d2) and non-solid electrolyte— 38 стр.
Railway applications. Track. Safety protection on the track during work. Common solutions and technologies. Technical requirements for Track Warning Systems (TWS)— 34 стр.
Multi-pair cables used in high bit rate digital access telecommunications networks. Indoor multi-pair/quad riser cables up to 100 MHz for maximum length of connection 100 m supporting universal services, xDSL and applications up to 100 Mbit/s over IP— 18 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Fixed resistors for use in electronic equipment. Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G— 48 стр.
Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 40 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011) (english version)
