Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 38 стр.
Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies— 44 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 38 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)— 122 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 40 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008) (english version)
