Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 38 стр.
Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies— 44 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing— 22 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies— 26 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies— 32 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys— 18 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 40 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials without surface processing— 20 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 40 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015) (english version)
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014) (english version)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013) (english version)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011) (english version)
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) (english version)
