Electrical engineering; basis environmental testing procedures; test Fc and guidance: vibration (sinusoidal); identical with IEC 60068-2-6:1982 (status as of 1985)
Electrical engineering; basic environmental testing procedures; tests; test U: robustness of terminations and integral mounting devices; identical with IEC 60068-2-21, edition 1983
Electrical engineering; basic environmental testing procedures; test Db and guidance: damp heat, cyclic (12 + 12-hour cycle); identical with IEC 60068-2-30, edition 1980 (status as of 1985)
Electrical engineering; basic environmental testing procedures; guidance to tests Z/AFc and Z/BFc: combined temperature (cold and dry heat) and vibration (sinusoidal) tests; identical with IEC 60068-2-53, edition 1984
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures— 122 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs— 57 стр.
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly— 41 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly— 46 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad— 45 стр.
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 41 стр.
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad— 45 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-4: Cyclic bending test (IEC 91/694/CD:2007)
Geometrical product specifications (GPS) - Dimensional measuring equipment: Micrometers for external measurements - Design and metrological characteristics (ISO 3611:2010); German version EN ISO 3611:2010— 30 стр.
Continuously cold-rolled stainless steel - Tolerances on dimensions and form - Part 1: Narrow strip and cut lengths (ISO 9445-1:2009); German version EN ISO 9445-1:2010— 12 стр.
Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016); German version EN ISO 9454-1:2016— 17 стр.
Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993); German version EN ISO 9455-2:1995— 8 стр.
Soft soldering fluxes - Test methods - Part 3: Determination of acid value, potentiometric and visual titration methods (ISO 9455-3:1992); German version EN ISO 9455-3:1994— 6 стр.
Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012); German version EN ISO 9455-10:2012— 15 стр.
Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO/DIS 9455-13:2016); German and English version prEN ISO 9455-13:2016
Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO/DIS 9455-14:2016); German and English version prEN ISO 9455-14:2016
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013); German version EN ISO 9455-16:2013— 26 стр.
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)