Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010— 22 стр.
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
Sampling procedures for inspection by attributes - Part 10: Introduction to the ISO 2859 series of standards for sampling for inspection by attributes (ISO 2859-10:2006); Text in German and English— 31 стр.
Electrical engineering; basis environmental testing procedures; test Fc and guidance: vibration (sinusoidal); identical with IEC 60068-2-6:1982 (status as of 1985)
Electrical engineering; basic environmental testing procedures; test Ga and guidance: acceleration, staedy state; identical with IEC 60068-2-7:1983 (status as of 1986)
Rules of procedure for the IEC Quality Assessment System for electronic components (IECQ) - Part 3: Approval procedures; technology Approval (IEC QC 001002-3:1995)
Electrical engineering; basic environmental testing procedures; tests; test N: change of temperature; identical with IEC 60068-2-14, edition 1984 (status as of 1986)
Electrical engineering; basic environmental testing procedures; tests; test U: robustness of terminations and integral mounting devices; identical with IEC 60068-2-21, edition 1983
Electrical engineering; basic environmental testing procedures; test Db and guidance: damp heat, cyclic (12 + 12-hour cycle); identical with IEC 60068-2-30, edition 1980 (status as of 1985)
Electrotechnic; basic environmental testing procedures; mounting of components, equipment and other articles for dynamic tests including shock (Ea), bump (Eb),vibration (Fc and Fd) and steady-state acceleration (Ga) and guidance; identical with IEC 60068-2-47, edition 1982
Electrical engineering; basic environmental testing procedures; guidance to tests Z/AFc and Z/BFc: combined temperature (cold and dry heat) and vibration (sinusoidal) tests; identical with IEC 60068-2-53, edition 1984
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
Electrical engineering; classification of environmental conditions; environmental conditions appearing in nature; temperature and humidity; identical with IEC 60721-2-1:1982 (status of 1987)— 27 стр.
Electrical engineering; classification of environmental conditions; classification of groups of environmental parameters and their severities; introduction and guide for users; identical with IEC 60721-3-0, edition 1984
Electrical engineering; classification of environmental conditions; classification of groups of environmental parameters and their severities; storage; identical with IEC 60721-3-1:1987
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
Letter symbols to be used in electrical technology - Part 3: Logarithmic and related quantities, and their units (IEC 60027-3:2002); German version HD 60027-3:2004
