Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
Fibre optic interconnecting devices and passive components - Performance standard - Part 141-2: Fibre optic passive chromatic dispersion compensator using single-mode dispersion compensating fibre for category C - Controlled environments (IEC 61753-141-2:2011); German version EN 61753-141-2:2011— 18 стр.
Fibre optic interconnecting devices and passive components - Performance standard - Part 087-6: Non-connectorised single-mode bidirectional 1 310 nm upstream and 1 490 nm downstream WWDM devices for category O - Uncontrolled environment (IEC 61753-087-6:2012); German version EN 61753-087-6:2012— 19 стр.
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012— 20 стр.
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010— 22 стр.
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013— 21 стр.
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016— 23 стр.
