Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads— 42 стр.
BS EN 60384-26. Fixed capacitors for use in electronic equipment. Part 26. Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte— 33 стр.
BS EN 60384-16. Fixed capacitors for use in electronic equipment. Part 16. Sectional specification: Fixed metallized polypropylene film dielectric d.c. capacitors— 35 стр.
BS IEC 62149-10. Fibre optic active components and devices. Performance standards. Part 10. RoF (radio over fiber) transceivers for mobile fronthaul— 18 стр.
Connectors for electrical and electronic equipment. Product requirements. Rectangular connectors. Detail specification for shielded and unshielded, free and fixed 10-way connectors with push-pull coupling for industrial environments for data transmission with frequencies up to 100 MHz— 42 стр.
BS IEC 60068-2-82. Environmental testing. Part 2-82. Tests. Test XW1. Whisker test methods for components and parts used in electronic assemblies— 36 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte— 34 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte— 36 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials without surface processing— 20 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 40 стр.
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat— 30 стр.
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads— 42 стр.
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
Components for low-voltage surge protective devices -- Part 331: Performance requirements and test methods for metal oxide varistors (MOV) ((IEC 61643-331:2017) EN IEC 61643-331:2018) (english version)
Environmental testing -- Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017) (english version)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013) (english version)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011) (english version)
Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT) (IEC 61643-311:2013) (english version)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008) (english version)
Fixed resistors for use in electronic equipment -- Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 60115-2:2014, modified) (english version)
Fixed capacitors for use in electronic equipment -- Part 26: Sectional specification - Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte ((IEC 60384-26:2018) EN IEC 60384-26:2018) (english version)
Fixed electric double-layer capacitors for use in electric and electronic equipment -- Part 1: Generic specification (IEC 62391-1:2015) (english version)
Passive filter units for electromagnetic interference suppression -- Part 3: Passive filter units for which safety tests are appropriate (IEC 60939-3:2015 + COR 1:2016) (english version)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 3: Selection guidance of erosion test methods (IEC 62739-3:2017) (english version)
