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IEC 60068-2-58:1989 ed1.0

Заменен
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD) — 25 стр.
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
ICS
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
19.040 Environmental. Including testing equipment / Климатические испытания. Включая испытательное оборудование