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IEC 60068-2-58:1989 ed1.0

Заменен
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD) — 25 стр.
IEC 60068-2-58:1989 ed1.0
Заменен
IEC 60068-2-58:2015 ed4.0
Действует