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IEC 60749-22:2002 ed1.0

Действует
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength — 41 стр.
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом