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IEC
IEC 60749-28:2017 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
— 97 стр.
Описание
Изменения
Ссылки
Версии
Ссылочные документы
IEC 60749-28:2022 ed2.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
— 98 стр.
IEC PAS 62162:2000 ed1.0
Заменен
Field-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components
— 7 стр.
На этот документ ссылаются
BS EN 62604-1:2015
Действует
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality. Generic specification
— 38 стр.
BS EN 62575-1:2016
Действует
Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality. Generic specification
— 42 стр.
BS EN 60862-1:2015
Действует
Surface acoustic wave (SAW) filters of assessed quality. Generic specification
— 50 стр.
BS IEC 62615:2010
Действует
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
— 24 стр.
OVE EN 62575-1:2016-11
Действует
Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality -- Part 1: Generic specification (IEC 62575-1:2015) (english version)
OVE EN 60749-43:2020-01
Действует
Semiconductor devices - Mechanical and climatic test methods -- Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017) (english version)
OVE EN 62604-1:2016-05
Действует
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality -- Part 1: Generic specification (IEC 62604-1:2015) (english version)
IEC 60749-28:2022 ed2.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
— 98 стр.
IEC PAS 62162:2000 ed1.0
Заменен
Field-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components
— 7 стр.
IEC 60749-3:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
— 7 стр.