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IEC 60749-37:2008 ed1.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer — 39 стр.
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом