Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 17 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards— 34 стр.
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013) (english version)
Environmental testing -- Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017) (english version)
