Detail Specification: Fixed low power film resistors. Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads— 38 стр.
BS IEC 60068-2-82. Environmental testing. Part 2-82. Tests. Test XW1. Whisker test methods for components and parts used in electronic assemblies— 36 стр.
BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards— 34 стр.
Connectors for electronic equipment. Tests and measurements. Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses— 14 стр.
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 60115-2:2014, modified); German version EN 60115-2:2015— 71 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004— 27 стр.
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G (IEC 60115-8-1:2014, modified); German version EN 60115-8-1:2015— 47 стр.
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015— 44 стр.
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods (IEC 62884-3:2018); German version EN IEC 62884-3:2018— 15 стр.
Fixed electric double-layer capacitors for use in electronic equipment - Part 1: Generic specification (IEC 62391-1:2006); German version EN 62391-1:2006— 34 стр.
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004— 29 стр.
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses (IEC 60512-16-21:2012) (english version)
Fixed resistors for use in electronic equipment -- Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 60115-2:2014, modified) (english version)
