IEC PAS 60191-6-19:2008 ed1.0

Заменен

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage — 22 стр.

Описание Изменения Ссылки Версии

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Заменен на

IEC 60191-6-19:2010 ed1.0

ICS

31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом