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ÖVE/ÖNORM EN 60747-15:2012-10

Действует
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60270:2000+AMD1:2015 CSV ed3.1
Действует
High-voltage test techniques - Partial discharge measurements — 226 стр.
IEC 60664-1:2007 ed2.0
Заменен
Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests — 148 стр.
IEC 60721-3-3:1994 ed2.0
Заменен
Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 3: Stationary use at weatherprotected locations — 79 стр.
IEC 60747-1:2006 ed2.0
Действует
Semiconductor devices - Part 1: General — 89 стр.
IEC 60747-2:1983 ed1.0
Заменен
Semiconductor devices - Discrete devices - Part 2: Rectifier diodes — 101 стр.
IEC 60747-6:1983/AMD2:1994 ed1.0
Заменен
Amendment 2 - Semiconductor devices - Discrete devices - Part 6: Thyristors — 113 стр.
IEC 60747-7:2010+AMD1:2019 CSV ed3.1
Действует
Semiconductor devices - Discrete devices - Part 7: Bipolar transistors — 418 стр.
IEC 60747-8:1984/AMD2:1993 ed1.0
Заменен
Amendment 2 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors — 23 стр.
IEC 60747-9:2007 ed2.0
Заменен
Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) — 117 стр.
IEC 60749-5:2017 ed2.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test — 9 стр.
IEC 60749-6:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature — 7 стр.
IEC 60749-10:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock — 0 стр.
IEC 60749-12:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency — 7 стр.
IEC 60749-15:2020 RLV ed3.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 27 стр.
IEC 60749-21:2011 ed2.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability — 44 стр.
IEC 60749-25:2003 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling — 25 стр.
IEC 60749-34:2004 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling — 21 стр.
BS EN 60270:2001
Действует
High-voltage test techniques. Partial discharge measurements — 54 стр.
BS EN 60664-1:2007
Действует
Insulation coordination for equipment within low-voltage systems. Principles, requirements and tests — 78 стр.
BS EN 60721-3-3:1995
Действует
Classification of environmental conditions. Classification of groups of environmental parameters and their severities, Stationary use at weatherprotected locations — 48 стр.
BS EN 60749-5:2017
Действует
Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test — 16 стр.
BS EN 60749-6:2017
Действует
Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature — 12 стр.
BS EN 60749-10:2002
Действует
Semiconductor devices. Mechanical and climatic test methods. Mechanical shock — 8 стр.
BS EN 60749-12:2002
Заменен
Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency — 8 стр.
BS EN 60749-15:2010
Действует
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices — 10 стр.
BS EN 60749-21:2011
Действует
Semiconductor devices. Mechanical and climatic test methods. Solderability — 24 стр.
BS EN 60749-25:2003
Действует
Semiconductor devices. Mechanical and climatic test methods. Temperature cycling — 16 стр.
BS EN 60749-34:2010
Действует
Semiconductor devices. Mechanical and climatic test methods. Power cycling — 12 стр.