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ÖVE/ÖNORM EN 60749-20-1:2009-12

Действует
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60749-20:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 49 стр.
IEC 60749-30:2005+AMD1:2011 CSV ed1.1
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing — 28 стр.
BS EN 60749-30:2005
Действует
Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing — 16 стр.