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ÖVE/ÖNORM EN 60749-20:2010-05

Действует
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60068-2-20:2008 ed5.0
Заменен
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads — 40 стр.
IEC 60749-3:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection — 7 стр.
IEC 60749-35:2006 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components — 43 стр.
BS EN 60068-2-20:2008
Действует
Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads — 22 стр.
BS EN 60749-3:2002
Заменен
Semiconductor devices. Mechanical and climatic test methods. External visual examination — 8 стр.
BS EN 60749-35:2006
Действует
Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components — 24 стр.

На этот документ ссылаются

DIN EN 60749-30:2005-06
Отменен
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005); German version EN 60749-30:2005 — 15 стр.