Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-27:2012) (english version)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012) (english version)
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012) (english version)
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 61249-2-30:2012) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015) (english version)
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-41:2010) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (english version)
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-42:2010) (english version)
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads (IEC 60947-4-3:2014) (english version)
Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning ((IEC 61189-2-630:2018) EN IEC 61189-2-630:2018) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) ( IEC 61189-2-719:2016) (english version)
Materials for printed boards and other interconnecting structures -- Part 2-44: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ( IEC 61249-2-44:2016) (english version)
Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies ( IEC 61189-5-1:2016) (english version)
Printed boards and printed board assemblies - Design and use -- Part 7: Electronic component zero orientation for CAD library construction ( IEC 61188-7:2017) (english version)
Materials for printed boards and other interconnecting structures -- Part 2-43: Reinforced base materials clad and unclad – Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ( IEC 61249-2-43:2016) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015) (english version)
