Connectors for electrical and electronic equipment - Product requirements -- Part 3-122: Detail specification for 8-way, shielded, free and fixed connectors for I/O and Gigabit Ethernet applications in harsh environments (IEC 61076-3-122:2017) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson`s ratio of thin film MEMS materials (IEC 62047-21:2014) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015) (english version)
Connectors for electronic equipment - Tests and measurements - Part 24-1: Magnetic interference tests - Test 24a: Residual magnetism (IEC 60512-24-1:2010) (english version)
Connectors for electronic equipment - Tests and measurements - Part 23-2: Screening and filtering tests - Test 23b: Suppression characteristics of integral filters (IEC 60512-23-2:2010) (english version)
