Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks (IEC 61587-2:2011) (english version)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60927-3-106:2010) (english version)
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013) (english version)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012) (english version)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013) (english version)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor (IEC 60297-3-107:2012) (english version)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U chassis (IEC 60297-3-105:2008) (english version)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008) (english version)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 60917-2-4:2010) (english version)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets (IEC 61587-4:2012) (english version)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment (IEC 60917-2-5:2012) (english version)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012) (english version)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (IEC 61587-3:2013) (english version)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units (IEC 60297-3-108:2014) (english version)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013) (english version)
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019) (english version)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018) (english version)
