Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates— 12 стр.
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015) (english version)