Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte— 34 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2— 46 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1— 42 стр.
BS EN 60384-24:2015/Cor1 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT ,,. Part 24: Sectional specification – Fixed tantalum electrolytic surface mount capacitors with conductive polymer solid electrolyte ,,— 36 стр.
BS EN 60384-24:2015/Cor1 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT ,,. Part 24: Sectional specification – Fixed tantalum electrolytic surface mount capacitors with conductive polymer solid electrolyte ,,— 36 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)
Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses (IEC 60512-16-21:2012) (english version)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011) (english version)
Fixed capacitors for use in electronic equipment - Part 22: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 (IEC 60384-22:2001) (english version)
High frequency inductive components - Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment (IEC 62674-1:2012) (english version)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018) (english version)
Potentiometers for use in electronic equipment -- Part 6: Sectional specification - Surface mount preset potentiometers ( IEC 60393-6:2015) (english version)
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators -- Part 1: Basic methods for the measurement (IEC 62884-1:2017) (english version)
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 17 стр.
