Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method— 28 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)— 122 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 40 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications— 48 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (english version)
High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 62024-1:2017) (english version)
