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ISO 9454-2:1998

Действует
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements — 12 стр.
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На этот документ ссылаются

BS EN 61190-1-2:2007
Заменен
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly — 22 стр.
BS EN 61190-1-2:2014
Действует
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly — 26 стр.
BS EN 61190-1-1:2002
Действует
Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 26 стр.
BS EN 1775:2007
Действует
Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations — 48 стр.
BS EN 61190-1-3:2007+A1:2010
Заменен
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 40 стр.
BS EN IEC 61190-1-3:2018
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications — 48 стр.
BS EN 16125:2015
Действует
LPG Equipment and Accessories. Pipework systems and supports. LPG in liquid phase and vapour pressure phase — 46 стр.
18/30353479 DC
Действует
BS EN 16125. LPG Equipment and Accessories. Pipework systems and supports. LPG in liquid phase and vapour pressure phase — 43 стр.
BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
BS EN 60068-2-58:2015+A1:2018
Действует
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 46 стр.
ÖVE/ÖNORM EN 60068-2-58:2016-03
Заменен
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
ÖVE/ÖNORM EN 61190-1-2:2015-11
Действует
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014) (english version)