Semiconductor devices - Micro-electromechanical devices -- Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016) (english version)
Semiconductor devices - Semiconductor interface for automotive vehicles -- Part 4: Evaluation method of data interface for automotive vehicle sensors ((IEC 62969-4:2018) EN IEC 62969-4:2018) (english version)
