Semiconductor devices - Micro-electromechanical devices -- Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson`s ratio of thin film MEMS materials (IEC 62047-21:2014) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013) (english version)
