Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016) (english version)
Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018) (english version)
Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency ((IEC 60749-12:2017) EN IEC 60749-12:2018) (english version)
Semiconductor devices - Semiconductor interface for human body communication -- Part 2: Characterization of interfacing performances ( IEC 62779-2:2016) (english version)
Semiconductor devices - Semiconductor interface for human body communication -- Part 3: Functional type and its operational conditions ( IEC 62779-3:2016) (english version)
Semiconductor devices - Mechanical and climatic test methods -- Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017) (english version)
Semiconductor devices - Mechanical and climatic test methods -- Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices ( IEC 60749-44:2016) (english version)
Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) (english version)
