Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series -- Part 5: Cooling performance evaluation for indoor cabinets ( IEC 62610-5:2016) (english version)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 2: Erosion test method for metal materials with surface processing (IEC 62739-2:2016) (english version)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 3: Selection guidance of erosion test methods (IEC 62739-3:2017) (english version)
Semiconductor devices - Semiconductor interface for human body communication -- Part 2: Characterization of interfacing performances ( IEC 62779-2:2016) (english version)
Semiconductor devices - Semiconductor interface for human body communication -- Part 3: Functional type and its operational conditions ( IEC 62779-3:2016) (english version)
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators -- Part 1: Basic methods for the measurement (IEC 62884-1:2017) (english version)
Identification and communication interoperability method for external power supplies used with portable computing devices ( IEC 63002:2016) (english version)
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019) (english version)
Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-110: Residential racks and cabinets for smart houses (IEC 60297-3-110:2018) (english version)
Fixed capacitors for use in electronic equipment -- Part 26: Sectional specification - Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte ((IEC 60384-26:2018) EN IEC 60384-26:2018) (english version)
Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency ((IEC 60749-12:2017) EN IEC 60749-12:2018) (english version)
Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning ((IEC 61189-2-630:2018) EN IEC 61189-2-630:2018) (english version)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018) (english version)
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan (IEC 62239-1:2018) (english version)
