Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014— 11 стр.
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015— 28 стр.
Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures— 34 стр.
BS IEC 62047-31. Semiconductor devices. Micro-electromechanical devices. Part 31. Four-point bending test method for interfacial adhesion energy of layered MEMS materials— 14 стр.
BS EN IEC 63203-401-1. Wearable electronic devices and technologies. Part 401-1. Devices and Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor— 15 стр.
Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates— 12 стр.
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014) (english version)
Semiconductor devices - Micro-electromechanical devices -- Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015) (english version)
