BS IEC 62047-31. Semiconductor devices. Micro-electromechanical devices. Part 31. Four-point bending test method for interfacial adhesion energy of layered MEMS materials— 14 стр.
Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates— 12 стр.
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014) (english version)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson`s ratio of thin film MEMS materials (IEC 62047-21:2014) (english version)
