Semiconductor devices - Mechanical and climatic test methods -- Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017) (english version)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 49 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)— 27 стр.
