Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2014); German version EN 62148-15:2014— 23 стр.
Connectors for frequencies below 3 MHz - Part 10: Connectors for coupling an external low-voltage power supply to portable entertainment equipment— 11 стр.
Connectors for frequencies below 3 MHz - Part 16: Printed circuit board mounted connectors with two rows of staggered contacts and terminations with spacing of 2,54 mm (0,1 in)— 16 стр.
Connectors for frequencies below 3 MHz - Part 17: Detailspecification for interconnection devices which permit multi-directional mating, for use with rechargeable batteries— 67 стр.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fourth supplement— 5 стр.
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)— 34 стр.
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)— 32 стр.
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)— 25 стр.
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)— 22 стр.
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON— 24 стр.
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)— 36 стр.
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA— 21 стр.
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)— 34 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 11: Detail specification for concentric connectors (dimensions for free connectors and fixed connectors) (IEC 60603-11:1992)
Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Two-part connectors for printed boards, for basic grid of 2.54 mm (0.1 in), with common mounting— 29 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 3: Two-part connectors for printed boards having contacts spaced at 2,54 mm (0,100 in) centres and staggered terminations at that same spacing— 17 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 4: Two-part connectors for printed boards having contacts spaced at 1,91 mm (0,075 in) centres and staggered terminations at that same spacing— 18 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 5: Edge-socket connectors and two-part connectors for double-sided printed boards with 2,54 mm (0,1 in) spacing— 27 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 6: Edge socket connectors and printed board connectors with 2,54 mm (0,1 in) contact spacing for single or double-sided printed boards of 1,6 mm (0,063 in) nominal thickness— 39 стр.
Connectors for electronic equipment - Part 7-2: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmission with frequencies up to 100 MHz (IEC 48B/1293/CD:2003)
Connectors for electronic equipment - Part 7-3: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz— 173 стр.
Connectors for electronic equipment - Part 7-41: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmission with frequencies up to 500 MHz (IEC 48B/1693/CD:2006)
Connectors for electronic equipment - Part 7-51: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 500 MHz (IEC 48B/1694/CD:2006)
Connectors for electronic equipment - Part 7-71: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 1000 MHz (IEC 48B/1695/CD:2006)
Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm Ч 0,63 mm (IEC 60603-8:1990)
Connectors for frequencies below 3 MHz for use with printed boards - Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in) (IEC 60603-9:1990)
Connectors for frequencies below 3 MHz for use with printed boards - Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type— 45 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits (IEC 60603-12:1992)
Connectors for frequencies below 3 MHz for use with printed boards - Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displacement terminations (ID)— 83 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment— 29 стр.
Optical fibre cables -- Part 2-11: Indoor cables - Detailed specification for simplex and duplex cables for use in premises cabling ((IEC 60794-2-11:2019) EN IEC 60794-2-11:2019) (english version)
Optical fibre cables -- Part 2-21: Indoor cables - Detailed specification for multi-fibre optical distribution cables for use in premises cabling ((IEC 60794-2-21:2019) EN IEC 60794-2-21:2019) (english version)
Optical fibre cables - Part 2-30: Indoor cables - Family specification for optical fibre ribbon cables for use in terminated cable assemblies (IEC 60794-2-30:2019) (english version)
Optical fibre cables - Part 2-31: Indoor cables - Detailed specification for optical fibre ribbon cables for use in premises cabling (IEC 60794-2-31:2019) (english version)
Optical fibre cables - Part 2-51: Indoor cables - Detail specification for simplex and duplex cables for use in cords for controlled environment— 22 стр.
Optical fibre cables - Part 3-60: Outdoor cables - Family specification for drinking water pipe cables and subducts for installation by blowing and/or pulling/dragging/floating in drinking water pipes— 66 стр.
Optical fibre cables - Part 3-12: Outdoor cables - Detailed specification for duct and directly buried optical telecommunication cables for use in premises cabling— 17 стр.
Optical fibre cables - Part 3-21: Outdoor cables - Detailed specification for optical self-supporting aerial telecommunication cables for use in premises cabling— 15 стр.
Optical fibre cables - Part 3-30: Outdoor cables - Family specification for optical telecommunication cables for lakes, river crossings and coastal application— 46 стр.
Optical fibre cables - Part 3-40: Outdoor cables - Family specification for sewer cables and conduits for installation by blowing and/or pulling in non-man accessible storm and sanitary sewers— 74 стр.
Optical fibre cables - Part 3-50: Outdoor cables - Family specification for gas pipe cables and subducts for installation by blowing and/or pulling/dragging in gas pipes— 31 стр.
Optical fibre cables - Part 5-10: Family specification - Outdoor microduct optical fibre cables, microducts and protected microducts for installation by blowing— 66 стр.
Optical fibre cables - Part 5-20: Family specification - Outdoor microduct fibre units, microducts and protected microducts for installation by blowing— 62 стр.
Safety of laser products - Part 12: Safety of free space optical communication systems used for transmission of information (IEC 60825-12:2019) (english version)
Connectors for optical fibres and cables - Part 19-3: Fibre optic adaptor (duplex) type SC for multimode fibre connectors - Detail specification (IEC 86B/2401/CDV:2006)
Connectors for optical fibres and cables - Part 14-1: Detail specification for fibre optic connector type SC/PC standard terminated to multimode fibre type A1a, A1b— 17 стр.
Connectors for optical fibres and cables - Part 14-2: Detail specification for fibre optic connector type SC/PC tuned terminated to single-mode fibre type B1— 16 стр.
Connectors for optical fibres and cables - Part 14-5: Detail specification for fibre optic connector type SC-PC untuned terminated to single-mode fibre type B1— 16 стр.
Connectors for optical fibres and cables - Part 14-7: Detail specification for fibre optic connector type SC-APC 9° tuned terminated to single-mode fibre Type B1— 17 стр.
Connectors for optical fibres and cables - Part 14-9: Fibre optic connector type SC-APC tuned 8° terminated on single mode fibre type B1 - Detail specification— 19 стр.
Connectors for optical fibres and cables - Part 14-10: Fibre optic pigtail or patch cord connector type SC-APC untuned 8° terminated on single mode fibre type B1 - Detail specification— 19 стр.
Connectors for optical fibres and cables - Part 19-1: Fibre optic patch cord connector type SC-PC (floating duplex) standard terminated on multimode fibre type A1a, A1b - Detail specification (IEC 86B/2404/CDV:2006)
Connectors for optical fibres and cables - Part 19-2: Fibre optic adaptor (duplex) type SC for single-mode fibre connectors - Detail specification— 18 стр.
Connectors for electronic equipment - Part 2-102: Circular connectors with assessed quality - Detail specification for plugs and jacks for external low voltage power supply— 61 стр.
Connectors for electronic equipment - Product requirements - Part 2-104: Circular connectors - Detail specification for circular connectors with M8 screw-locking or snap-locking— 71 стр.
Connectors for electronic equipment - Product requirements - Part 2-106: Circular connectors - Detail specification for circular connectors M16 x 0,75 with screw-locking degree of protection IP40 (IEC 48B/1798/CD:2007)
Connectors for electronic equipment - Product requirements - Part 2-107: Detail specification for circular hybrid connectors M12 with electrical and fibre-optic contacts with screw locking (IEC 48B/1936/CD:2008)
Connectors for electronic equipment - Product requirements - Part 2-109: Circular connectors - Detail specification for connectors with M 12 x 1 screw-locking, for data transmission frequencies up to 500 MHz— 57 стр.
Connectors for use in d.c., low-frequency analogue and digital high speed data applications - Part 3-100: Rectangular connectors with assessed quality - Detail specification for a range of shielded connectors with trapezoidal-shaped shells and non-removable ribbon contacts on a 1,27 mm double row— 81 стр.
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 3: Rectangular connectors - Section 101: Detail specification for a range of shielded connectors with trapezoidal shaped shells and non-removable rectangular contacts on a 1,27 mm x 2,54 mm centre-line— 125 стр.
Connectors for electronic equipment - Part 3-103: Rectangular connectors - Detail specification for single row connectors with non-removable ribbon cable contacts on 1,25 mm pitch used for high speed serial data (HSSDC)— 115 стр.
Connectors for electronic equipment - Product requirements - Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 1 000 MHz— 166 стр.
Connectors for electrical and electronic equipment - Product requirements - Part 3-106: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for industrial environments incorporating the IEC 60603-7 series interface (IEC 48B/2727/CD:2019); Text in German and English
Connectors for electronic equipment - Product requirements - Part 3-110: Detail specification for shielded, free and fixed connectors for data transmission with frequencies up to 1 000 MHz— 37 стр.
Connectors for electronic equipment - Part 3-112: Rectangular connectors - Detail specification for rectangular connectors with four contacts for high performance serial bus for consumer audio/ video equipment— 71 стр.
Connectors for electronic equipment - Part 3-114: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 11 related to IEC 61076-3-106 - Bayonet coupling type (IEC 48B/1667/CD:2006)
Connectors for electronic equipment - Part 3-115: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 12 related to IEC 61076-3-106 - Push-pull type (IEC 48B/1668/CD:2006)
Connectors for electronic equipment - Part 3-116: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 13 related to IEC 61076-3-106 - Bayonet coupling with spring clamp (IEC 48B/1669/CD:2006)
Connectors for electronic equipment - Product Requirements - Part 3-117: Rectangular connectors: Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 1000 MHz for industrial environments incorporating the 60603-7 - Variant 14 related to IEC 61076-3-106 - Push pull coupling (IEC 48B/1743/CD:2006)
Connectors for electronic equipment - Product requirements - Part 3-118: Rectangular connectors: Detail specification for a 4 poles + PE power connector with push-pull coupling (IEC 48B/1876/CD:2008)
Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm— 43 стр.
Connectors with assessed quality, for use in d.c., low-frequencyanalogue and in digital high-speed data applications - Part 4:Printed board connectors - Section 001: Blank detail specification— 129 стр.
Connectors with assessed quality for use in d.c. and low frequency analogue applications and in digital applications with high s peed data rates - Part 4: Printed board connectors - Section 100 : Detail specification for two-part connector modules having a grid of 2,5 mm (0,098 in) for printed boards and backplanes— 159 стр.
Corrigendum 1 - Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917— 0 стр.
Connectors with assessed quality for use in d.c., low-frequencyanalogue and in digital high speed data applications - Part 4:Printed board connectors - Section 102: Detail specification fortwo-part single-pole connectors, for multiple uses on plug-inunits, with pre-centring, coding and early mating features, havinga metric grid in accordance with IEC 60917— 67 стр.
Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors with shielding and a basic grid of 2,5 mm— 127 стр.
Connectors for use in d.c., low frequency analogue and digital high speed data applications - Part 4-104: Printed board connectors with assessed quality - Detail specification for two-part modular connectors, basic grid of 2,0 mm, with terminations on a multiple grid of 0,5 mm— 143 стр.
Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 105 : Detail specification for 9 mm circular connector with 3 to 8 contacts for use in a wide range of applications including the telecommunication .— 89 стр.
Connectors for electronic equipment - Part 4-107: Printed board connectors with assessed quality - Detail specification for shielded two-part connectors having a basic grid of 2,0 mm, fixed part with solder and press-in terminations for printed boards, free part with non-accessible insulation displacement and crimp terminations— 87 стр.
IEC 61076-4-108: Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1— 71 стр.
Connectors for electronic equipment - Part 4-110: Printed board connectors with assessed quality - Detail specification for latched cable connector system having a basic grid of 2,0 mm including full shielding and latching function— 111 стр.
Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications— 73 стр.
Connectors for electronic equipment - Product requirements - Part 7-100: Cable outlet accessories - Detail specification for a metric cable sealing consisting of an integrated part of heavy-duty rectangular or circular connector hoods and a sealing system— 35 стр.
Fibre optic communication subsystem basic test procedures - Part 1-1: Test procedures for general communication subsystems - Transmitter output optical power measurement for single-mode optical fibre cable— 15 стр.
Fibre optic communication subsystem basic test procedures - Part 1-3: Test procedures for general communication subsystems - Central wavelength and spectral width measurement (IEC 86C/838/CD:2008)
Fibre optic communication subsystem test procedures - Part 1-4: General communication subsystems - Light source encircled flux measurement method (IEC 86C/819/CD:2008)
Fibre optic communication subsystem basic test procedures - Part 2-1: Test procedures for digital systems - Receiver sensitivity and overload measurement (IEC 86C/827/CD:2008)
Fibre optic communication subsystem test procedures - Part 2-2: Digital systems - Optical eye pattern, waveform and extinction ratio measurement— 51 стр.
Fibre optic communication subsystem basic test procedures - Part 2-3: Test procedures for digital systems - Jitter and wander measurements (IEC 86C/794/CD:2007)
Fibre optic communication subsystem test procedures - Digital systems - Part 2-8: Determination of low BER using Q-factor measurements (IEC 86C/1639/CD:2019); Text in German and English
Fibre optic communication subsystem test procedures - Part 2-9: Digital systems - Optical signal-to-noise ratio measurement for dense wavelength-division multiplexed systems (IEC 86C/781/CD:2007)
Fibre optic communication subsystem test procedures - Part 2-10: Digital systems - Time-resolved chirp and alpha-factor measurement of laser transmitters— 47 стр.
Fibre optic communication subsystem test procedures - Part 2-11: Digital systems - Averaged Q-factor determination using amplitude histogram evaluation for optical signal quality monitoring— 67 стр.
Fibre optic communication subsystem test procedures - Part 2-12: Digital systems - Measuring eye diagrams and Q-factor using a software triggering technique for transmission signal quality assessment— 39 стр.
Fibre-optic communication subsystem test procedures - Part 4-2: Installed cable plant - Single-mode attenuation and optical return loss measurement— 157 стр.
Fibre optic communication subsystem test procedures - Part 4-4: Cable plants and links - Polarization mode dispersion measurement for installed links— 133 стр.
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 37: Type MDC connector family (IEC 86B/4375/CD:2020); Text in German and English
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 7-1: Type MPO connector family - Single fibre row (IEC 86B/3059/CD:2010)
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 20-11: Interface standard for LC connectors with protective housings related to IEC 61076-3-106 (IEC 86B/2682/CD:2008)
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 20-100: Interface standard for LC connectors with protective housings related to IEC 61076-3-106— 17 стр.
Fibre optic connector interfaces - Part 24-11: Interface standard for SC-RJ connectors with protective housings related to IEC/PAS 61076-3-117 (IEC 86B/2548/CD:2007)
Fibre optic connector interfaces - Part 24-21: Interface standard for SC-RJ connectors with protective housings related to IEC 61076-3-106 (IEC 86B/2549/CD:2007)
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics— 136 стр.
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2021); German version EN IEC 62148-15:2021
Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2017); German version EN ISO 1101:2017
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2009); German version EN 62148-15:2010— 17 стр.
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2009); German version EN 62148-15:2010— 17 стр.
