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PD IEC/TS 62686-1:2015

Действует
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications. General requirements for high reliability integrated circuits and discrete semiconductors — 68 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

ISO 14001:2015
Действует
Environmental management systems -- Requirements with guidance for use — 44 стр.
IEC TS 62564-1:2011 ed2.0
Заменен
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors — 19 стр.
BS IEC 62483:2013
Действует
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices — 52 стр.
IEC 62418:2010 ed1.0
Действует
Semiconductor devices - Metallization stress void test — 34 стр.
IEC 62417:2010 ed1.0
Действует
Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) — 16 стр.
IEC 62416:2010 ed1.0
Действует
Semiconductor devices - Hot carrier test on MOS transistors — 20 стр.
IEC 62415:2010 ed1.0
Действует
Semiconductor devices - Constant current electromigration test — 22 стр.
IEC 62374-1:2010 ed1.0
Действует
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers — 32 стр.
IEC TS 62239-1:2012 ed1.0
Заменен
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan — 52 стр.
IEC 61340-5-1:2007 ed1.0
Заменен
Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements — 38 стр.
IEC 60749-38:2008 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory — 26 стр.
IEC 60749-36:2003 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state — 7 стр.
IEC 60749-34:2004 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling — 21 стр.
IEC 60749-33:2004 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave — 17 стр.
IEC 60749-32:2002 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) — 9 стр.
IEC 60749-30:2005+AMD1:2011 CSV ed1.1
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing — 28 стр.
IEC 60749-29:2003 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test — 41 стр.
IEC 60749-26:2013 ed3.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) — 91 стр.
IEC 60749-25:2003 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling — 25 стр.
IEC 60749-23:2004 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life — 17 стр.
IEC 60749-22:2002/COR1:2003 ed1.0
Действует
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength — 0 стр.
IEC 60749-21:2004 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability — 45 стр.
IEC 60749-20-1:2009 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 63 стр.
IEC 60749-20:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 0 стр.
IEC 60749-19:2003 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength — 11 стр.
IEC 60749-17:2003 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation — 11 стр.
IEC 60749-15:2003 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 11 стр.
IEC 60749-14:2003 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) — 27 стр.
IEC 60749-12:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency — 0 стр.
IEC 60749-10:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock — 0 стр.
IEC 60749-9:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking — 0 стр.
IEC 60749-8:2002/COR2:2003 ed1.0
Действует
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing — 0 стр.
IEC 60749-7:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases — 0 стр.
IEC 60749-6:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature — 0 стр.
IEC 60749-5:2003 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test — 13 стр.
IEC 60749-4:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) — 0 стр.
IEC 60695-11-5:2004 ed1.0
Заменен
Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance — 20 стр.
ISO 9001:2008
Заменен
Quality management systems -- Requirements — 36 стр.
ISO 9001:2015
Действует
Quality management systems -- Requirements — 40 стр.
PD IEC/TS 62686-1:2012
Действует
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications. General requirements for high reliability integrated circuits and discrete semiconductors — 66 стр.